Techno-economic feasibility analysis of an extreme heat flux micro-cooler

iScience. 2022 Dec 16;26(1):105812. doi: 10.1016/j.isci.2022.105812. eCollection 2023 Jan 20.

ABSTRACT

An estimated 70% of the electricity in the United States currently passes through power conversion electronics, and this percentage is projected to increase eventually to up to 100%. At a global scale, wide adoption of highly efficient power electronics technologies is thus anticipated to have a major impact on worldwide energy consumption. As described in this perspective, for power conversion, outstanding thermal management for semiconductor devices is one key to unlocking this potentially massive energy savings. Integrated microscale cooling has been positively identified for such thermal management of future high-heat-flux, i.e., 1 kW/cm2, wide-bandgap (WBG) semiconductor devices. In this work, we connect this advanced cooling approach to the energy impact of using WBG devices and further present a techno-economic analysis to clarify the projected status of performance, manufacturing approaches, fabrication costs, and remaining barriers to the adoption of such cooling technology.

PMID:36624838 | PMC:PMC9823160 | DOI:10.1016/j.isci.2022.105812

Share:

Related Posts

Leave a Reply

Your email address will not be published. Required fields are marked *

Generated by Feedzy